INTERMETALLIC AND JOINT STRENGTH STUDY OF Sn-9Zn SOLDER WITH ADDITION OF CARBON NANOTUBE UNDER LIQUID STATE AGING

Abstract

In this study, the effect of carbon nanotube (CNTs) on the intermetallic and joint strength study of Sn-9Zn lead free solder under liquid state aging was investigated. The formations of intermetallic were observed under scanning electron microscopy (SEM) and the thicknesses of the intermetallic were measured by using imageJ software. Only Cu5Zn8layer was found for Sn-9Zn/Cu interface. Meanwhile, there was three type of intermetallic formed for Sn-9Zn-0.1CNT/Cu interface which were Cu₅Zn₈, Cu₃Sn and Cu6Sn5. The thickness of intermetallic increased as the time of aging increases. However, the thickness of intermetallic formed with the addition of CNT was slightly smaller than those solder without the CNT. The joint strength of the Sn-9Zn solder was higher compared to Sn-9Zn-0.1CNT.