MECHANICAL PROPERTIES OF HIGHLY DEFORMED SN-3.0AG-0.5CU SOLDER WIRE

Abstract

In this study, mechanical properties of highly deformed Sn-3.0Ag-0.5Cu (SAC305) lead free solder wire were investigated. The SAC305 solder wire underwent tensile test with 0.1 mms-1 strain rate at room temperature, and 25 °C and at 120 °C chamber conditions. The mechanical properties of the deformed solder wires were evaluated from a stress strain curve by tensile test followed by nanoindentation test. Micromechanical behavior of deformed solder wires was determined using nanoindentation multicycle method. Results showed that the deformed SAC305 solder wire at room temperature have a high yield stress compared to SAC305 solder wire at 120 °C temperature. The hardness values of the deformed SAC305 solder wire at room temperature were higher than the hardness values of SAC305 solder wire at 120 °C temperature. The decreasing of hardness values in the SAC305 solder wire at 120 °C was due to existence of additional heat. In addition, thermal induced the softening behaviour of deformed SAC305 solder wire.